Operations

SMM has been providing products such as bonding wires, lead frames and COF (Chip On Film) tapes to be used for package material of semiconductors, Copper-clad Polyimide Film to be used as material for flexible wiring board to be frequently used for COFs, and printed wiring boards to be used for various electronics instruments.
In Semiconductor Materials Business, SMM's technologies such as stamping, plating, etching and wire drawing is applied to various products. For lead frames, our high-quality products are supported by stamping metal foil made by copper material, 42-alloy material, etc. with use of ultraprecision metal mold or by processing ultrafine lead by etching operation. For COF tapes, our high-quality products are supported by precise etching operation enabling ultrafine pitch copper wiring to be performed. In addition, for flexible substrate material, we hold a copper plating method characterized in both strong adherence on a polyimide film and flexibility. For bonding wires, We product finer gold wires and copper wires than a human hair by applying subtle technology for wire drawing. We will continue to provide material for semiconductor having higher-fineness and higher function to the semiconductor markets of countries throughout the world, including Japan.

"Let materials have functions" could be stated about this field, namely the creation of new materials. SMM can make full use of its smelting and refining technologies that have been accumulated for more than 400years in this business field. SMM have been providing various advanced materials such as thick film materials, sputtering targets, crystal materials, powder materials, functional inks and battery materials.
Various film formation materials containing gold, silver, copper, nickel or indium as a major component are used for various chip parts including multilayer ceramic capacitors, flat panels, solar cells and secondary cells. We have been providing materials in a shape in compliance with your request, for example powder, ink paste or forming material for evaporation sputtering formed to a predetermined shape. With respect to crystal material to be used for LEDs (light-emitting diode) for which demand currently expands, ICs, laser communicators, etc., this material is processed to the shape of a wafer or a rod. Also, solder materials such as alloy preforms to be used for every electronics parts as adhesive materials, these materials are processed to various shapes such as a wire, a ribbon, a pellet, a ball and paste. In addition, we have been providing various products such as high-performance magnet material to be used for various compact motors including precision instruments, optical isolators which are optical parts indispensable for optical fiber communications, and insolation shielding material which shuts out infrared rays.
SMM has been manufacturing these products at base factories spreading to domestic and Asian areas and providing the products. SMM has also been proceeding with technological development aiming at higher function of the products.