Lead Frames Metal frames serve as the foundation for the chip circuits of LSIs, transistors, etc. They are produced through performing frame shaping and then applying silver plating to the connectors, utilizing the method of stamping them with an ultraprecision mold or etching in which photographic technology is applied. Alongside the progress of high-precision mounting, miniaturization in units of microns and high accuracy have been required in the lead frame processing, in addition to new functions in the lead frame itself. We accommodate these market needs through the pursuit of quality and the development of new processing technologies.
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