In assembling various semiconductor packages such as power transistors, ICs, optical parts, high-frequency devices, and MEMS, various brazing (soldering) alloy materials of Au- and Sn-based, etc., are used. SMM provides a wide range of high-quality brazing materials with versatile compositions, as well as a special composition made especially for package assembly in which flux cannot be used, by processing them into the shapes of ribbons, wires, and balls that are suitable for the assembly systems of each customer.
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