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Thick Film Materials

Thick Film Paste

Thick Film Materials
Overview
Thick Film Materials Thick Film Materials is ink paste produced through mixing, kneading, and dispersing of metal powders, glass powders, and inorganic oxides with organic solvent in a three-roll mill.
Major types of pastes are shown below.
  1. Conductive paste with Au/Ag/Pd/Ni/Cu, etc., contained as conductive materials
  2. Resistive paste as a resistor material
  3. Insulation paste used for the protective films of circuits, etc.
In general use, circuit patterns, etc., are screen-printed on ceramic boards or green sheets, and then burned. They are mainly used for various electronic components such as multilayer chip capacitors, chip resistors, etc. These components are used in volume in personal computers, mobile phones, etc.
Also, Ag resin paste, which hardens at low temperatures, is applied to various die attachments used in LEDs and ICs, etc.
SMM has established technological know-how and a sales network through more than 30 years of development, manufacturing, and sales activities.
Now, SMM holds paste manufacturing facilities in Ome City in Tokyo and Shanghai in China, and supplies products for the market in Japan as well as for the markets in Korea, Taiwan, China, Southeast Asia, Europe, and the United States.
Quality characteristics
Refer here for details.
Applications
  1. Internal electrodes and terminal electrodes for multilayer ceramic capacitors
  2. Electrodes/Resistive elements/Insulators for chip resistors
  3. Electrically conductive adhesives for optical devices such as LEDs
  4. Electrodes/Resistive elements/Insulators for HICs (Hybrid IC)
  5. Electrodes/Resistive elements for various circuit boards
Consult with us for various types of paste materials aside from those introduced above.
Packaging
Consult with us.
Contact
Thick Film Materials Group, Sales & Marketing Dept., Advanced Materials Div. (E-mail:Paste_DN@ni.smm.co.jp)
Phone: 81-3-3436-7872 Facsimile: 81-3-3436-7827

Nickel Powder

Nickel Powder

▲ SNP-YH series
(with 0.2 µm particle size)

Overview
In recent years, materials used for internal electrodes of multilayer ceramic capacitors have rapidly been changing from precious metals like palladium to nickel powder. SMM meets customer needs with our technology for producing high-purity materials and technology for controlling powder materials, which we have cultivated over the years since beginning development of the nickel internal electrode.
Characteristics
"SNP-YH series"
This is spherical nickel powder that does not contain coarse particles, but contains particles of an even particle size. Very smooth print film can be produced, and it is suitable for forming the thin electrode film required in high-end multilayer ceramic capacitors. It can also meet the need for fine particles with an 0.1 µm particle size.
Applications
  1. Material for electrodes of multilayer ceramic capacitors
  2. Conductive paste
  3. Powder metallurgy
Contact
Thick Film Materials Group, Sales & Marketing Dept., Advanced Materials Div. (E-mail:Paste_DN@ni.smm.co.jp)
Phone: 81-3-3436-7872 Facsimile: 81-3-3436-7827

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Copper Powder

Copper Powder
Overview
This is copper powder produced using the application of technology for controlling powder materials that SMM has cultivated over the years. The particle size is even and it is highly dispersive. It is highly oxidation-resistant, and storing/handling is easy.
Characteristics
  1. The particle size is even and it is highly dispersive.
  2. It is highly oxidation-resistant, and storing/handling is easy.
  3. particle size
    UCP-030 (Average particle size (SEM) is 0.4-0.5 µm)
Applications
  1. Conductive materials
  2. Electromagnetic shielding materials
  3. Conductive filler
Contact
Thick Film Materials Group, Sales & Marketing Dept., Advanced Materials Div. (E-mail:Paste_DN@ni.smm.co.jp)
Phone: 81-3-3436-7872 Facsimile: 81-3-3436-7827

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