Direct Bonded SiC Substrate "SiCkrest" Adopted for Power Semiconductor Devices by Shindengen Electric Manufacturing Co., Ltd.

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December 22, 2025
Sumitomo Metal Mining Co., Ltd.

Tokyo, Japan - Sumitomo Metal Mining Co., Ltd. (TSE: 5713) is pleased to announce that its direct bonded silicon carbide (SiC) substrate "SiCkrest®" has been adopted for metal-oxide-semiconductor field-effect transistor (MOSFET), a power semiconductor device, developed by Shindengen Electric Manufacturing Co., Ltd.

Please check the below PDF file for details.

Direct Bonded SiC Substrate "SiCkrest" Adopted for Power Semiconductor Devices by Shindengen Electric Manufacturing Co., Ltd.